Encapsulation of Flexible Biomedical Microimplants with Parylene C

Parylene has been used as encapsulation material since several decades, e.g. for wires, needles and pacemaker coatings. Within this paper, its use as insulation and protection layer for flexible biomedical microimplants is described. Investigations on the deposition, structuring with reactive ion etching and the cytotoxic behavior of the etched layers led to promising results. Parylene seems to be an appropriate material to protect hybrid assemblies of microimplants from water and ions.